Why use RDL-first?

To avoid known-good die loss during packaging, an alternate fan-out process called RDL-first/chip-last fan-out packaging is used, where the RDL is first built on a carrier wafer, and KGD are placed on top of a known good RDL location thereby avoiding KGD loss. The RDL-first process also offers other advantages in terms of finer line/space dimensions for RDL to offer complex routing for denser device integration and a higher I/O count.

BrewerBUILD™ Material Benefits

• Single-layer material for RDL buildup and assembly
• Mechanical, chemical, and thermal stability to withstand RDL-first process flows
• Compatible with wafer-level and panel-level processes
• Laser debond compatible (308 nm, 355 nm, etc.)
• Spin-On packaging compatibility
• Multi-chip integration
• Achieves high-density RDLs with smaller-pitch line-space patterning