Brewer Science presents EUV lithography innovation at largest tech conference in Asia
Roles of underlayers in EUV lithography is the keynote speech at CSTIC 2022
Rolla, Mo. June 20, 2022 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, will present the keynote address, Roles of Underlayers in Novel Patterning for EUV Lithography, at the China Semiconductor Technology International Conference (CSTIC), one of the largest and the most comprehensive annual semiconductor technology conferences in Asia.
Semiconductor Innovation Requires Materials for Extreme Ultraviolet Lithography (EUV)
EUV lithography is used to pattern the smallest features in advanced semiconductor devices. The demand for smaller devices with more capabilities requires industry innovation in EUV processes and materials. Additionally, EUV plays a critical role in the evolution of technology and enables the continuous advancement of the semiconductor roadmap, as it provides the capabilities of higher processing power, while using less energy, and providing higher performance. However, one of the biggest challenges facing EUV lithography is material requirements, recognizing the critical role underlayers play in the patterning of EUV lithography. Unlike bottom anti-reflective coatings (BARC), thickness is not limited by wavelength, but rather related to resist and process requirements.
Roles of Underlayers in Novel Patterning for EUV Lithography
Dr. Douglas Guerrero, Senior Technologist at Brewer Science, has published over 60 papers in the areas of conducting polymers, BARCs, DSA, and underlayers for EUV lithography, and is an inventor on over 20 US patents. In his keynote address, Roles of Underlayers in Novel Patterning for EUV Lithography, during the Symposium II: Lithography and Patterning at CSTIC, he will provide information on the device and materials roadmap, as well as answer questions to the most critical questions in the industry:
- How does overall EUV patterning require thinner layers?
- What challenges do chemically amplified resists (CARs) and underlayers face?
- What role will underlayer play in future patterning?
- What are the options for patterning without a CAR?
Additionally, Zhimin Zhu, Senior Scientist at Brewer Science, will be co-chairing the Session II panel, Lithography Materials, within the Symposium II: Lithography and Patterning.
CSTIC will have nine symposiums covering all aspects of semiconductor technology with focus on manufacturing and advanced technology, including detailed manufacturing processes, device design, integration, materials, and equipment, as well as emerging semiconductor technologies, circuit design, and silicon material applications. CSTIC is organized by SEMI and IEEE-EDS, co-organized by IMECAS. The conference will be held June 14th, 2022 through July 12, 2022 accessed online through the SEMI Cloud.
If you are unable to attend, but wish to learn more about Brewer Science’s innovative EUV lithography materials, you can visit our website to view datasheets and schedule a call with an EUV expert.
About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique monitoring systems for industrial, environmental, and air applications. Our relationship-focused approach provides outcomes that facilitate and deliver critical information. Our headquarters are in Rolla, Missouri, with customer support throughout the world. We invite you to learn more about Brewer Science at www.brewerscience.com.
Tel: (US) +1.573.364.0300, ext. 1923