All Brewer Science® protective coatings allow micromachining to take place closer to packaging.
进一步了解Our line of products stretches across the whole spectrum of lithography wavelengths and is the most comprehensive product lineup in the industry.
进一步了解At Brewer Science, we are focused on delivering critical, real-time information to our customers to help them achieve their goals, solve their problems, and improve their current systems.
进一步了解Brewer Science is revolutionizing wafer-level packaging with innovate bonding and debonding technologies.
进一步了解The BrewerBOND® 530 mechanical debonding release material offers the additional adhesion necessary for high-stress temporary bonding applications.
BrewerBOND® 530 material is most compatible with the following Brewer Science bonding materials:
BrewerBOND® 530 material is a mechanical debonding release material that has been specifically designed for maximum performance with all of the temporary adhesives utilized for mechanical release. It is compatible with all external equipment manufacturers and mechanical release systems.
BrewerBOND® 530 material offers to our customers and partners the capability of easy rework/reuse of carrier wafers as it is solvent removable.
BrewerBOND® 530 Material