All Brewer Science® protective coatings allow micromachining to take place closer to packaging.
进一步了解Our line of products stretches across the whole spectrum of lithography wavelengths and is the most comprehensive product lineup in the industry.
进一步了解At Brewer Science, we are focused on delivering critical, real-time information to our customers to help them achieve their goals, solve their problems, and improve their current systems.
进一步了解Brewer Science is revolutionizing wafer-level packaging with innovate bonding and debonding technologies.
进一步了解PermaSOL™ materials address a range of needs identified for permanent bonding applications, which include low-temperature bonding, excellent chemical resistance, thermally curable bonding process and no material movement after the bonding process.
Permanent bonding materials are adhesives used to assemble IC logic chips, memory chips, image sensor devices, and microelectromechanical systems (MEMS) devices that go into high-density heterogeneously integrated packages. These high-density, ultra-thin electronic packages are needed for artificial intelligence (AI) in high-performance computers, data centers, 5G, and high-end mobile products.
Permanent Bonding Materials