All Brewer Science® protective coatings allow micromachining to take place closer to packaging.
进一步了解Our line of products stretches across the whole spectrum of lithography wavelengths and is the most comprehensive product lineup in the industry.
进一步了解At Brewer Science, we are focused on delivering critical, real-time information to our customers to help them achieve their goals, solve their problems, and improve their current systems.
进一步了解Brewer Science is revolutionizing wafer-level packaging with innovate bonding and debonding technologies.
进一步了解BrewerBOND® T1100/C1300 series materials enable our unique Dual-Layer solution for high-temperature and high-stress applications found within the semiconductor industry.
BrewerBOND® T1100/C1300 series materials enable our unique Dual-Layer solution for high-temperature and high-stress applications found within the semiconductor industry.
BrewerBOND® T1100 series materials are a thermoplastic platform applied to the device as a conformal adhesive coating.
BrewerBOND® C1300 series materials are a curable layer applied to the carrier that provides high-flow, low-temperature, and low-pressure bonding with no melt flow post-cure.
Together, these two layers enable mechanical stability with no movement and provide in-process thermal stability ≤ 400°C.
BrewerBOND® T1100/C1300 Series Materials