BrewerBOND® T1100/C1300 series materials enable our unique Dual-Layer solution for high-temperature and high-stress applications found within the semiconductor industry.
BrewerBOND® T1100/C1300 series materials enable our unique Dual-Layer solution for high-temperature and high-stress applications found within the semiconductor industry.
BrewerBOND® T1100 series materials are a thermoplastic platform applied to the device as a conformal adhesive coating.
BrewerBOND® C1300 series materials are a curable layer applied to the carrier that provides high-flow, low-temperature, and low-pressure bonding with no melt flow post-cure.
Together, these two layers enable mechanical stability with no movement and provide in-process thermal stability ≤ 400°C.
BrewerBOND® T1100/C1300 Series Materials
