BrewerBOND^® T1100/C1300 series materials enable our unique VersaLayer^TM system for high-temperature and high-stress applications found within the semiconductor industry.

Markets for VersaLayer^TM Solutions

• 3DIC
• Power
• MEMS
• FOWLP
• III-V

BrewerBOND^® T1100 series materials are a thermoplastic platform applied to the device as a conformal adhesive coating.

BrewerBOND^® C1300 series materials are a curable layer applied to the carrier that provides high-flow, low-temperature, and low-pressure bonding with no melt flow post-cure.

Together, these two layers enable mechanical stability with no movement and provide in-process thermal stability ≤ 400°C.