Temporary Bonding / Debonding Services

Processing and On-Wafer Film & Bonded Wafer Analysis
Request More Information About Bonding Services

Temporary Bonding Processing and Analysis

Brewer Science offers small-scale, feasibility-level temporary bonding and debonding process and analysis services.

With over 40 years of experience in semiconductor application testing and analysis, put Brewer Science's experience and world-class equipment to work.

State-of-the-art equipment, combined with our engineers' knowledge, experience, and skills, enable our bonding and debonding process and analysis capabilities.

Contact Us to Discuss Your Bonding Needs

bonding debonding analysis

General Process

  1. Coat
  2. Bake
  3. Bond
  4. Analysis
  5. Mechanical or Thermal Debond
  6. Analysis
  7. Cleaning

*Process tailored to the specific need.

Analysis Capabilities

  1. Wafer Thickness and Uniformity
  2. On-Wafer Film Thickness and Uniformity
  3. Bonded Wafer Film Thickness and Uniformity
  4. Bondline Quality Analysis

Learn More About Analysis Capabilities

Contact Us

Contact Us

Temporary Bonding / Debonding Services

Powered by Translations.com GlobalLink OneLink Software