Temporary Bonding Processing and Analysis
Brewer Science offers small-scale, feasibility-level temporary bonding and debonding process and analysis services.
With over 40 years of experience in semiconductor application testing and analysis, put Brewer Science's experience and world-class equipment to work.
State-of-the-art equipment, combined with our engineers' knowledge, experience, and skills, enable our bonding and debonding process and analysis capabilities.
Contact Us to Discuss Your Bonding Needs