May 29 – June 1, 2018
San Diego, California
May 29 – June 1, 2018
Sheraton San Diego Hotel & Marina
San Diego, California
Description: The Electronic Components and Technology Conference (ECTC) is an international event that brings together the best in packaging, components and microelectronic systems in an environment of cooperation and technical exchange. Learn more about the upcoming conference here.
Make sure to stop by for Brewer Science sessions during the conference to gain industry insight from some of our top leaders.
Session 8: Fan-Out Packaging – Applications and Architectures
Time: Wednesday, May 30, 2018
1:30 PM – 5:10 PM
Location: Harbor Island 2
Speaker: Chia-Hsin Lee and Jay Su
Title: An RDL-First Fan-out Wafer-Level Package for Heterogeneous Integration Applications
Session 26: Wafer-Level Packaging Fan-In and Fan-Out Key Developments
Time: Friday, June 1, 2018
10:25 AM
Location: Northern Hemisphere Foyer
Speaker: Shelly Fowler
Title: Dual-Carrier Process Using Mechanical and Laser Release Technologies for Fan-Out Wafer Level Packaging
Session 37: Interactive Presentations 1
Time: Wednesday, May 30, 2018
9:00 AM- 11:00 AM
Location: Nautilus Foyer on the Lower Level
Speaker: Jay Su
Title: Optimization of Laser Release Process for Throughput Enhancement of Fan-Out Wafer Level Packaging
Session 38: Posters 2
Time: Wednesday, May 30, 2018
2:00 PM -4:00 PM
Location: Northern Hemisphere Foyer
Speaker: Hong Zhang
Title: Novel Temporary Adhesive Materials for RDL-First Fan-Out Wafer-Level Packaging
You can view the complete technical program here.
