October 23-25, 2018
San Jose, CA
October 23-25, 2018
DoubleTree by Hilton San Jose
San Jose, CA
Brewer Science will attend the 15th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry’s most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing.
Addressing wafer-level packaging, 3D, and Advanced Manufacturing & Test technologies, the International Wafer-Level Packaging Conference (IWLPC) has been at the forefront of packaging technology evolution. The conference has a rich history of bringing together attendees from over 16 countries in the heart of Silicon Valley to immerse themselves in the latest technology and business trends. Learn more about IWLPC by reading the full conference bio.
Don’t forget to mark your calendars for your favorite sessions here, learn more about the upcoming conference by visiting the IWLPC website. Don’t forget to check out our wide range of bonding and debonding technologies and learn more about how Brewer Science is affecting the “Evolution of Wafer-Level Packaging”
