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Directed self-assembly (DSA) refers to the integration of block copolymer (BCP) materials that undergo phase separation with traditional manufacturing processes. With DSA, nanoscale dimensions are achieved at a drastically reduced…
June 15, 2017 Blogs Read MoreHigh-k metal gate (HKMG) technology has become one of the front-runners for the next generation of CMOS devices. This new technology incorporates a high-k dielectric, which reduces leakage and improves…
Read MoreA variety of factors can affect the coat quality when spin processing. This article will focus on the role that the bowl environment, and in particlar the ability to control…
Read MoreCost of ownership plays an important role in lithography process materials and methods decisions. Process simplifications brought about by layer-to-layer synergy drive significant cost of ownership advantages for multilayer lithography…
Read MoreLimitations of Moore's Law Ultimately, performance of computers and other electronic products will be limited by transistor size and density. Because the semiconductor industry has pushed to create ever-smaller features…
Read MoreFabrication of microelectronic devices increasingly involves the creation of high-aspect-ratio structures (those with large height or depth and narrow width, such as trenches, vias, columns, and mesas). These structures provide…
Read MoreProcess application engineers often encounter a variety of complex challenges related to deposition by spin coating, as many variables affect the quality of the spin-applied coating. These variables have critical…
Read MoreNew lithographic compositions, for use as middle layers in trilayer processes resist processes can be applied as very thin films with a very thin layer of photoresist being applied to…
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