Advanced materials for the protection and enhancement of optics, displays, and other microelectronics.
进一步了解Brewer Science is revolutionizing packaging solutions with innovative bonding and debonding technologies.
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Brewer Science’s High-Temperature-Stable, Gapfilling Planarizing Material Revolutionizes Advanced ArF and EUV Processes OptiStack® SOC450 material provides zero shrinkage up to 550°C when baking in N2 June 15, 2023 – Rolla,…
June 15, 2023 Press Release Read MoreAdam Scotch will be presenting, "Arrays for On-Demand Water Quality Monitoring" at the virtual TechBlick event on June 22nd, at 18:13 Berlin Time. Register for the free virtual event on…
Read MoreImec and Brewer Science present process solutions for CVD oxide deposition processes on ultrathin wafers at Electronic Components and Technology Conference (ECTC) Process challenges during CVD oxide deposition on the…
Read MoreAdaptation, Transition, and Inspiration for Success Join Tom Brown, Executive Director, Semiconductor Business Unit at Brewer Science, as he shares inspirational leadership advice and professional growth stories. Pursuing a goal…
Read MoreCo-presenting “Photonic Debonding for Wafer–Level Packaging” at CS MANTECH, held May 15-18 in Orlando, FL. Orlando, Florida – April 25, 2023 – Brewer Science, Inc. and PulseForge, Inc. bring substantial…
Read MoreJiadeng Zhu presents Printed and Flexible CO2 Sensors Prepared via Different Carbon Materials: A Comparison Study at The World Conference of Carbon 2023 at Cancun, Mexico on July 16 -…
Read MoreJoin Tom Brown, Executive Director of Semiconductor Business Unit at Brewer Science, as he shares inspirational leadership advice and professional growth stories How people spend their time, money, and energy…
Read MoreIn an uncertain world, the possibilities are endless. At Brewer Science, our people have been the source of innovation for over 40 years. Hear from founder Terry Brewer and our…
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