Advanced materials for the protection and enhancement of optics, displays, and other microelectronics.
进一步了解Brewer Science is revolutionizing packaging solutions with innovative bonding and debonding technologies.
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Vichy, Missouri - August 15, 2023 - Brewer Science, a global leader in developing and manufacturing next-generation materials and products for the semiconductor industry, is thrilled to announce the expansion…
Event Read MoreBrewer Science’s High-Temperature-Stable, Gapfilling Planarizing Material Revolutionizes Advanced ArF and EUV Processes OptiStack® SOC450 material provides zero shrinkage up to 550°C when baking in N2 June 15, 2023 – Rolla,…
Read MoreImec and Brewer Science present process solutions for CVD oxide deposition processes on ultrathin wafers at Electronic Components and Technology Conference (ECTC) Process challenges during CVD oxide deposition on the…
Read MoreCo-presenting “Photonic Debonding for Wafer–Level Packaging” at CS MANTECH, held May 15-18 in Orlando, FL. Orlando, Florida – April 25, 2023 – Brewer Science, Inc. and PulseForge, Inc. bring substantial…
Read MoreNew developments in underlayers play key role in advanced EUV lithography Rolla, Mo.– April 11, 2023 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials for…
Read MoreBrewer Science Earns GreenCircle Certification for Zero Waste to Landfill for Eighth Consecutive Year Brewer Science is the first company in the semiconductor industry with GreenCircle Certification Rolla, Mo.– March…
Read MoreReal-time measurement of lead, nitrate and pH using printed sensors presented at LOPEC Munich, Germany – February 21, 2023 – Brewer Science, Inc., a global leader in developing and…
Read MoreAdvanced and legacy processes are improved by this next-generation material having superior gapfilling and planarizing capabilities and simplified, defect-free, and extremely clean removal. Rolla, MO – February 8, 2023…
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