Glass Steps Into the Temporary Bonding Spotlight
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Advanced materials for the protection and enhancement of optics, displays, and other microelectronics.
进一步了解Brewer Science is revolutionizing packaging solutions with innovative bonding and debonding technologies.
进一步了解Wax | BrewerBOND® 230 Material | |
---|---|---|
Thickness Range | ~ 10 – 35 µm | 20 µm – 150 µm |
Coating Throughput | Requires multiple coats | Single-coat process |
Bonding Temperature Range | 95ºC - 110ºC | 100ºC – 130ºC |
Debonding Temperature Range | 95ºC - 110ºC | 150ºC – 200ºC |
Thermal Stability Temperature Range | < 120ºC | ≤ 250ºC |
For coatings thicker than 20 µm, BrewerBOND® 220 material is a good option as an alternative solution to typical wax adhesives. It offers significant advantages because it can be applied with a one-coat process. The material provides up to a 160-μm film with a single coat and customized spin process. BrewerBOND® 220 material enables backside temperature processing up to 250°C with minimal device wafer bowing. BrewerBOND® 220 material does not introduce additional stress in the bonded stack. This versatile material can be used for the thermal slide or mechanical debonding methods.