With ProTEK® B3 coatings, you can:
- Protect delicate front-side circuitry during back-side bulk micro machining
- Increase yield by minimizing front side damage caused by alkaline etch solution punch through during wet etch
- Improve throughput by reducing labor and process time associated with mechanical clamps and increasing the number of wafers per etch bath
Apply ProTEK® B3 coating instead of mechanical clamps to:
- Protect CMOS circuitry or MEMS structures
- Create SiN membranes last
- Create through-silicon vias (TSVs)