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October 15, 2018 Blogs
2018 Outlook for Advanced Packaging Materials

Advanced packaging is moving mainstream as manufacturers continue to seek ways to improve device performance beyond traditional scaling. The semiconductor industry is also witnessing increasing investments in packaging, in terms…

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October 15, 2018 Blogs
Solving the Truck Driver Shortage Through AI

According to the American Trucking Association, there is a shortage of roughly 50,000 truck drivers across the country. In 2017, the ATA predicted the trucking industry would experience the highest…

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October 15, 2018 Blogs
The Digital Era: Combining AI and IoT

Imagine an intelligent world where highways formulate warning messages and diversions, retail managers are alerted when a product is low in stock on shelves or cities are able to detect…

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April 15, 2018 Blogs
Environmental Awareness: How to Build a Culture of Environmental Responsibility

Protecting our environment and conserving resources are essential to running a successful and mindful business, but how do you make this part of your organization’s mission and vision? The key…

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April 15, 2018 Blogs
Sacrificial Laser Release Materials for RDL-First Fan-out Packaging

 Article published in Chip Scale review's March - April 2018; Volume 22, Number 2 Issue The semiconductor industry is in a new age where device scaling will not continue to…

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March 15, 2018 Blogs
Geothermal Power Offers Key Benefits for Sustainable Manufacturing

According to the U.S. Energy Information Administration (EIA), U.S. production and consumption of non-hydro renewable energy sources (i.e., biofuels, biomass, geothermal, solar, wind) set new records in the first half…

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February 15, 2018 Blogs
From the Bottom Up: Making More Room with Selective Surface Modification

Richard Feynman, who won the Nobel Prize in Physics in 1965, gave a famous lecture titled “There's Plenty of Room at the Bottom.” Today’s microelectronics process engineer, in the context…

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