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High-uniformity bake plates have been displacing convection ovens for well over two decades in the microelectronics industry. The disadvantages of variable temperature zones, lengthened cure times, and considerable particle contamination…
October 15, 2016 Blogs Read MoreAs semiconductor devices evolve, smaller and smaller feature sizes are required to achieve the performance desired by the consumer. Smaller features give rise to lower power consumption for mobile devices,…
Read MoreOne of the most critical variables in spin-coating processes is coating uniformity. In many cases, engineers are challenged with achieving ultralow total thickness variation at high film thicknesses while conserving…
Read MoreWearable devices are all the rage right now, from FitBit products and the Apple Watch to the ever-evolving and highly anticipated Google Glass. But the idea and creation of wearable…
Read MoreWhat was founded in Berlin, performs all year across Europe, Japan and North America, and returns annually to entertain classical music aficionados in Missouri? That’s the Jacques Thibaud String Trio,…
Read MoreThanksgiving arrives a little early for all of us in the semiconductor industry. On November 16th, we cruise over to Santa Clara, California, to participate in the IDTechEx Printed Electronics…
Read MoreIn 1977, Intel introduced the 16-bit CPU at a small inaugural semiconductor event in Tokyo. While that 16-bit marvel is now a relic in the computing world, that little event…
Read MoreRemember WWII’s Rosie the Riveter, the strong and capable figure symbolizing real-life women who took over factory work for men fighting overseas? Manufacturers are wishing Rosie would make a comeback…
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