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进一步了解Brewer Science is revolutionizing packaging solutions with innovative bonding and debonding technologies.
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Imagine you’ve decided to undertake a home improvement project; you’re going to lay tile in the downstairs powder room. To begin, you remove the old vinyl flooring. Underneath are clumps…
October 15, 2019 Blogs Read MoreUncover endless possibilities with Brewer Science, a leading innovator in technology. Each year, we offer a variety of internships, co-ops and post-doc opportunities to those seeking a career in technology.…
Read MoreSince our inception, Brewer Science has been strongly committed to cultivating diversity. And we do so for one primary reason: a broad range of backgrounds leads to better ideas…
Read MoreAs part of the manufacturing and innovation industry, Brewer Science relies on the growth of STEM education, jobs, and overall interest in the subjects to maintain our business model in…
Read MoreThin-wafer processing trends Several spin-coating process applications require the ability to uniformly coat, develop, and/or rinse (clean) thinned and fragile substrates. Safely handling these fragile materials is paramount and requires…
Read MoreThermal slide debonding represents the next significant advancement in obtaining high-yield thin wafer results. Initial detection of anomalies and cracks usually occurs during debonding; however, many causes for this damage…
Read MoreIn addition to precisely controlling application of the materials that enable wafer bonding, a solvent-enriched sealed spin chamber contributes to process integrity. One of the most critical variables in achieving…
Read MoreThe microelectronics industry is rapidly migrating to fabricating 3-D wafer stacking interconnects using through-silicon via (TSV) technology. Major market segments seeking to benefit from TSV technology include advanced packaging for…
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