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May 31st - June 3rd, 2016 Event
ECTC

Presentation Friday, June 3rd · 2:20PM Session 36: 3D materials & Processing Extremely Low-Force Debonding of Thinned CMOS Substrate by Laser Release of a Temporary Bonding Material" Alain Phommahaxay, Goedele…

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May 16-19, 2016 Event
CS ManTech

Compound Semiconductor Manufacturing 2016 See the next generation of temporary bonding equipment and thin wafer handling technology for SiC and compound semiconductor at the Brewer Science 2016 CS Mantech booth.…

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Event
EUV Lithography Symposium

October 24-26, 2016 Hiroshima, Japan http://euvl2016.org/ Please look for Tanti Ouattara's poster at 2016 International EUVL Symposium.

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June 10, 2020 Event
Best Practices for Virtual Internships Webinar

Best Practices for Virtual Internships Webinar Julie Littrell, Sr. HR Director at Brewer Science, joins a webinar discussing how employers can offer virtual internships and the benefits it carries Watch…

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July 2020 Event
2020 IEEE 70th Electronic Components and Technology Conference

Brewer Science participated in the 2020 IEEE 70th Electronic Components and Technology Conference (ECTC). Xiao Liu, Senior Program Manager at Brewer Science, presented 'Introduction of a New Carrier System for…

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Event
Laser Debonding in 2D and 3D Heterogeneous Applications featured in Chip Scale Review

Alice Guerrero, Senior Applications Engineer in Wafer-Level Packaging at Brewer Science, and Koen Kennes, Research and Development Engineer at imec, contributed to Chip Scale Review with a discussion of the…

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Event
Chief Resource Officer Dan Brewer Set to Deliver Keynote Speech at Tech and Innovation Summit

Chief Resource Officer Dan Brewer Set to Deliver Keynote Speech at Tech and Innovation Summit Remarks Highlight Missouri's Robust Technological Advancements https://youtu.be/hMrs2M_Oeko   ROLLA, Mo., Aug. 18, 2021 -- Brewer…

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Event
2021 Brewer Science Hosts Pure Enjoyment Art Exhibit Virtual and In-Person

2021 Brewer Science Hosts Pure Enjoyment Art Exhibit Virtual and In-Person [caption id="attachment_8670" align="alignright" width="193"] Forest Greens - Morgan Bippes[/caption] Springfield, MO - November 1, 2021 – Brewer Science, in…

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Event
Wafer-level polymer/metal hybrid bonding using a photosensitive permanent bonding material featured in Chip Scale Review

Baron Huang, Mei Dong, Shelly Fowler, Andrea Chacko, and Rama Puligadda contributed to Chip Scale Review with a discussion of Wafer-level polymer/metal hybrid bonding using a photosensitive permanent bonding material.…

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Event
Brewer Science presents EUV lithography innovation at largest tech conference in Asia

Brewer Science presents EUV lithography innovation at largest tech conference in Asia Roles of underlayers in EUV lithography is the keynote speech at CSTIC 2022   Rolla, Mo. June 20,…

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