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February 22-26, 2021 Event
FLEX 2021 Virtual Conference

FLEX, the flexible hybrid electronics (FHE) go-to event, is the center of technical and informative demonstration of flexible hybrid, printed electronics products, equipment, processes, materials, and the applications they enable.…

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February 22-26, 2021 Event
SPIE Advanced Lithography Virtual Conference 2021

As the primary global lithography event, the SPIE Advanced Lithography technical program focuses on works in optical lithography, metrology, and EUV. Industry and academic leaders come to solve challenges in…

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January 15, 2021 Blogs
Leadership Failure – Treating Employees Like Children

Join Tom Brown, Executive Director of Operations at Brewer Science, as he shares inspirational leadership advice and professional growth stories.   ​As a wily veteran of parenting and corporate management,…

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January 11, 2021 Press Release
40 Years of Innovation – Brewer Science Celebrates Its 40th Anniversary, Daring to Innovate

Rolla, Mo.–January 1, 2021– Brewer Science is celebrating 40 years of being a global leader in developing and manufacturing advanced materials utilized in cutting-edge micro-devices. Dr. Terry Brewer founded Brewer…

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Jan. 27th at 12pmCST Event
MSU Bicentennial Webinar Series: Changing Lives Through Technology, Science and Innovation

Dr. Brewer presented at Missouri State University's Bicentennial Webinar Series: "Changing Lives Through Technology, Science and Innovation" on January 27th at 12pmCST. If you were unable to attend the virtual…

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Event
Laser Debonding in 2D and 3D Heterogeneous Applications featured in Chip Scale Review

Alice Guerrero, Senior Applications Engineer in Wafer-Level Packaging at Brewer Science, and Koen Kennes, Research and Development Engineer at imec, contributed to Chip Scale Review with a discussion of the…

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November 25, 2020 Press Release
Brewer Science Featured in Silicon Semiconductor

Kim Arnold, Chief Development Officer, and Kim Yess, Executive Director of WLP Materials, sat down with SiS to discuss temporary bonding and debonding materials that are enabling next generation semiconductor…

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