Advanced materials for the protection and enhancement of optics, displays, and other microelectronics.
进一步了解Brewer Science is revolutionizing packaging solutions with innovative bonding and debonding technologies.
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This was another banner year for Brewer Science, one in which it won several awards, showed off its cutting-edge technology at multiple industry events and gave back to the community…
October 15, 2017 Blogs Read MoreOctober 29-November 2, 2017 Tampa, FL Don’t miss our presentation Materials and Methods for Bottom-Up Semiconductor Device Manufacturing by Selective Surface Modification, Reuben Chacko, J. Lowes, J. Dai, S. Brown,…
Read MoreOctober 24-26, 2017 San Jose, CA Double Tree by Hilton San Jose Attend our presentation at Wafer Level Packaging (WLP) Processes Session 4 The Dual-layer Bonding Platform as A Technical…
Read MoreOctober 9-12, 2017 Raleigh, NC Attend our joint paper with SUSS MicroTec Ablative Laser Patterning of Polymeric Dielectric Materials Author(s): Cristina Matos, Brewer Science, Inc. (Deborah Blumenshine, Lisa Kirchner, Rama…
Read MoreSeptember 27-29, 2017 Barcelona, Spain Don’t miss the opportunity to attend our Sensors Applications session presentation Sensor Excitation and Measurement Techniques for CNT Thin-Film Sensors Louis McCarthy, Brewer Science…
Read MoreSeptember 13-15, 2017 Tokyo, Japan Sensor Expo Japan: Printed Electronics Tokyo Big Sight - East Hall Organizer: Fuji Sankei Business i. (The Nihon Kogyo Shimbun Co., Ltd.) Special…
Read MoreSept. 13, 2017 – Rolla, MO, USA, and Taipei, Taiwan – Brewer Science, Inc. is pleased to announce its participation in SEMICON Taiwan 2017. The company will share in a…
Read MoreLearning more about our debonding technologies.
Read MoreJanuary 16 - 17, 2025 • Silicon Valley, California [+]
January 27 - 29, 2025 • San Francisco, California [+]
• San Jose, California [+]
December 17, 2024
[+] Read MoreOctober 09, 2024
[+] Read MoreAugust 01, 2024
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