Brewer Science

Newsroom

Show Me All News Blog Ebooks Videos Press Releases Events

Related Articles

Laser Debonding in 2D and 3D Heterogeneous Applications featured in Chip Scale Review

Alice Guerrero, Senior Applications Engineer in Wafer-Level Packaging at Brewer Science, and Koen Kennes, Research and Development Engineer at imec, contributed to Chip Scale Review with a discussion of the fundamentals of laser debonding and the advantages it has for 2D and 3D heterogeneous integration. Brewer Science and imec have several different products and programs…

  brewer science, Wafer-Level packaging, WLP, Chip Scale Review Click Here to Read More
Top
Powered by Translations.com GlobalLink OneLink Software