Advanced materials for the protection and enhancement of optics, displays, and other microelectronics.
进一步了解Brewer Science is revolutionizing packaging solutions with innovative bonding and debonding technologies.
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In recognition of its progress with temporary bonding and thin wafer handling, Brewer Science was featured in the November/December issue of Chip Scale Review. The feature discusses the company’s use of wafer-level packaging (WLP) technologies in semiconductor segments, including fan-out WLP (FOWLP); fan-in wafer-level chip-scale package (FI-WLCSP); 3-D FOWLP; 2.5-D integration with interposer technology; and…
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