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Nine Essential Criteria to Achieve a Successful Bonding Process A photosensitive permanent bonding material enables the creation of high-quality permanent bonds between dissimilar materials used in the creation of MEMS and sensors. Having a thorough understanding of the materials and product performance is crucial to the success of the end application. In this article, we…
Click Here to Read MoreAdvanced packaging requires pitches below 10 µm. Hybrid bonding is the key to paving an innovative future in advanced packaging. Hybrid bonding provides a solution that enables higher bandwidth and increased power and signal integrity. As the industry looks to enhance device performance by scaling system-level interconnections, hybrid bonding provides the most promising solution with…
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