Brewer Science

Newsroom

Show Me All News Blog Ebooks Videos Press Releases Events

Related Articles

Thin-wafer handling: Spin chuck designs for thinned substrates

Thin-wafer processing trends Several spin-coating process applications require the ability to uniformly coat, develop, and/or rinse (clean) thinned and fragile substrates. Safely handling these fragile materials is paramount and requires specially designed spin chucks and thin-wafer handling techniques. The substrates are made of a wide array of materials, and some of the more popular ones…

  3D packaging, spin coat, LED manufacturing, Wafer-Level packaging, thin wafer handling Click Here to Read More
Top
Powered by Translations.com GlobalLink Web Software