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May 31, 2017 – Springfield, MO – Brewer Science today celebrated the Jordan Valley Innovation Center’s (JVIC) 10 years of collaborative research and development. Brewer Science, a major corporate partner of JVIC, joined members of the local business community; representatives from Missouri State University; and local, state, and federal representatives in celebrating this milestone. “We are grateful…
Click Here to Read MoreMay 25, 2017 – Taipei, Taiwan - Brewer Science invites you to join us at COMPUTEX TAIPEI 2017 to preview new technology that will enable Smart Cities. COMPUTEX TAIPEI 2017 is the premier event for releasing new products and technologies that will impact the Internet of Things (IoT) and will include over 1,600 exhibitors, predicted…
Click Here to Read MoreMay 22-25, 2017 Indian Wells, CA [Palm Springs] Booth: 315 CS Mantech: Compound Semiconductor Manufacturing Technology Hyatt Regency Indian Wells Resort & Spa Featured products at CS Mantech: BrewerBOND® 220 Material BrewerBOND® 305 Material BrewerBOND® 510 Material BrewerBOND® 701 Material WaferBOND® HT-10.10 Material WaferBOND® CR-200 Material Schedule a time or ask a question…
Click Here to Read MoreFebruary 10, 2017 – San Jose, CA – Brewer Science invites you to join us February 26 through March 2 at SPIE Advanced Lithography in San Jose, CA, as we showcase original technology products created and manufactured at Brewer Science. Attendees will have the opportunity to learn more about the Brewer Science suite of lithography…
Click Here to Read MoreMultilayer technology from Brewer Science has allowed the industry to continue to push the limits of advanced lithography well into the future. Our experts explain why it was needed and how it eventually became the industry standard for leading-edge semiconductor manufacturing.
Click Here to Read MoreWhy do we need temporary bonding technology? Ram Trichur is back to discuss how temporary wafer bonding technology allows IC manufacturers to safely handle ultra-thin wafers during advanced processing and packaging steps. Thinning the wafers before the chips are packaged allows for thinner electronic devices and overall better performance Check out our temporary bonding materials…
Click Here to Read MoreThrough the years, Brewer Science has been a major innovator in finding ways to improve consumer goods. Our work in anti-reflective coatings, for example, helped revolutionize the global microelectronics industry by allowing for higher-speed, lighter-weight, ultrapowerful devices. No longer must microprocessors depend on decreasing feature size to increase speed and power in any given product.…
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