February 26 - March 2
San Jose, California
Brewer Science will be presenting at the 2023 SPIE Advanced Lithography + Patterning in San Jose, California February 26th – March 2nd. Dr. Si Li, Senior Research Associate of R&D- Emerging Materials, will present Novel assist layer to enhance EUV lithography performance of photoresists on different substrate, on February 28th at 3:40pmPST in Grand Ballroom 220C.
Abstract:
Novel assist layer to enhance EUV lithography performance of photoresists on different substrate
Underlayer shows advantages in assisting photoresist-substrate adhesion and EUV patterning, especially at small features. To further enhance the lithographic performance and reduce the underlayer thickness, a novel sub-1-nm layer was proposed in contrast to the conventional 5-nm underlayers. Comprehensive studies on the structure, stability, coating quality, and surface energy were conducted. EUV lithography demonstrates improved process window, depth of focus, and LWR of spin-on layer on Si wafer, when compared to the non-modified substrate.
