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Photonic debonding provides a more cost-efficient, higher-throughput debond process

A high-level overview of wafer-level debonding options and considerations   As emerging technologies require ultrathinned device wafers, traditional debonding processes can pose some challenges. Photonic debonding is an innovative debonding process utilizing a carrier coated with an inorganic metal release layer that aids in the release of the thinned wafer from the carrier substrate with…