Wafer-Level Packaging Category
Our proven temporary wafer bonding systems are designed to fit into a variety of process scenarios with minimal disruption. We offer exclusive material for low-volume R&D environments, and we work with leading equipment vendors to provide fully automated solutions for higher-volume needs.
Brewer Science was one of the first companies to recognize the potential of temporary wafer bonding for ultrathin wafer handling. Connect with one of our experts today to see how we can optimize your ultrathin wafer handling process.Learn More
The introduction of BrewerBUILD™ Material offers an industry wide multifunctional solution addressing the challenges associated with redistribution layer (RDL)-first/Chip-last packaging in wafer- or p
BrewerBOND® T1100/C1300 Series Materials enable our unique VersaLayer solution for high-temperature and high-stress applications found within the semiconductor industry.
BrewerBOND® 530 mechanical debonding release material offers additional choices for stronger adhesions necessary for high stress/high temperature temporary bonding applications.
Temporary wafer bonding release material for mechanical debonding applications
This UV laser release material was designed to benefit a variety of temporary bonding, debonding market applications including chip-first/chip-last and RDL-first FOWLP processes.
BrewerBOND® 305 temporary wafer bonding material is an organic coating that enables back-end-of-line (BEOL) processing of ultrathin wafers using standard semiconductor equipment.